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(iTers News) – SUSS MicroTec, a global supplier of equipment and process solutions for the semiconductor industry and related markets, announces the extension of a joint development agreement (JDA) with the IBM Corporation. SUSS MicroTec Photonic...

SINGAPORE — 08 AUGUST 2014, UNITED STATES—(Marketwired – Aug 8, 2014) – STATS ChipPAC Ltd. (“STATS ChipPAC” or the “Company”) (SGX–ST: STATSChP) (SGX: S24), a leading provider of advanced semiconductor packaging and test services, today announced results...

Since the beginning of the decade there have been many predictions that stacked die were just over the hill, but the time it has taken to climb that hill has been longer than most people would have anticipated. In fact, TSMC has been fully capable of...

China’s new industry investment and government promotion policies outlined in the recent “National Guidelines for Development and Promotion of the IC Industry” represents major opportunities for China and global semiconductor companies. The details of...

From its companion post The Dawn of the SoC 2.0 Era: The ARM Perspective Source of the slide: ARM Cortex系列核心介绍 (Core ARM Cortex Series Introduction, 52RD, April 13, 2015) Regarding TSMC itself the April 8 conclusion in TSMC Outlines 16nm, 10nm Plans...