Open-Silicon has been invited to join Cadence’s Brandon Wang, Program Management Director, 3DIC, Custom IC & PCB Group, in a roundtable discussion on the below topic.
Mr. Steve Eplett, Manager, DTA at Open-Silicon will be representing the company.
Companies invited to participate are; Cadence, OpenSilicon, eSilicon, Mentor, TSMC, and Synopsys.
Topic:
More Moore and more than Moore. Looking at new fabrication technologies, 2.5 and 3D to find the economic sweet spot. What application/segment best fit for 3D, and 2.5D deployment?
Thermal solutions maybe available, but are they cost effective?
Monolithic 3D? What’s the impact, and what is the application?
Background on roundtables:
These roundtables are a meeting of the top minds in the semiconductor design and IP industry, chaired by Ed Sperling, Ann Mutschler or Brian Bailey.