DUBLIN, Jan. 02, 2015 /PRNewswire/ –Research and Markets
(http://www.researchandmarkets.com/research/t4dphj/equipment_and) has announced the addition of the “Equipment & Materials for 3DIC & Wafer-Level Packaging Applications “ report to their offering.
(Logo: http://photos.prnewswire.com/prnh/20130307/600769)
Mainly supported today by flip-chip wafer bumping, the equipment market generated revenue of more than $930M in 2013. It is expected that this equipment market revenue will peak at almost $2.5B. It is fueled by the 3D IC technology with TSV interconnects, an area offering opportunities for new developments in equipment modificationequipment that is much more expensive than the tools used for established Advanced Packaging platforms (3D WLP, WLCSP, flip-chip wafer bumping). Indeed, 2015 will be the key turning point for the adoption of 3D TSV Stacks since the memory manufacturers, such as Samsung, SK Hynix, Micron, have already started to ship prototypes this year and might be ready to enter in high-volume manufacturing next year.
Key Topics Covered:
1. Report scope & definitions
2. Glossary
3. Companies cited in this report
4. Definitions, limitations & methodology
5. Analysis comparison: 2011 vs. 2014
6. Who should be interested in this report?
7. Executive summary
8. Equipment market forecast for 3D & WLP
9. 3DIC & WLP technologies process flows & manufacturing trends analysis
10. Conclusions & perspectives
Companies Mentioned:
ALSI
AML
ASM Pacific Technologies
AST (Samurai)
ATMI
ATOTECH
AZ Electronic Materials
Alchimer
America Furukawa Inc.
Anji Microelectronics
Applied Materials
Asahi Kasei E-Materials Corporation
Auros Tech
Austin American Technology Corp
Brewer Science
Bruker AXS
CAMTEK USA
CHAPMAN
CSM Instruments
Cabot electronics
Canon ANELVA
Cascade Microtech
Chomerics (Parker Hannifin Corp.)
Corning
Corning Incorporated
Cyantek
Cyber-Technologies
DJ DevCorp
DYNATEX International
Dai Nippon SCREEN
Datacon Technology GmbH (BESI)
Daxin Materials Corporation
Denka
Disco Corporation
Dongjin Semichem Co.
Dow Corning Corporation
Dow Electronic Materials
DuPont Electronic Technologies
Dynaloy (Eastman Chemical Company)
EBARA Technologies Corp.
ECI Technology
EEJA
ENF Technology Co. Ltd
ERS electronic GmbH
ESEC AG
ESI
EV Group
EXCICO
Eastman Chemical
Ebina Denka
Electroglas Inc
Enterprix
Enthone (Cookson Electronics)
Epoxy Technology Inc.
Etched in Time Inc.
Evest Corp.
Exelsius
FASSE CO. LTD.
FOGALE Nanotech
FSI International
FUJIFILM Electronic Materials
Fico molding (BESI)
Finetech
Frontier Semiconductor
Frt Of America
Fuji Polymers
GE Sensing & Inspection Technologies
GPD Global
Gore
HD MicroSystems
HORIBA Semiconductor
HamaTech APE GmbH & Co. KG
Hamamatsu
Henkel Corporation
Heraeus GmbH
Hesse & Knipps
Hitachi Chemical Co. Ltd.
Hitachi High Technologies Corporation
Honeywell Electronic Materials
Inc
LORD Corporation
Loadpoint
MECO
MEMC Electronic Materials Inc.
MSG Lithoglas AG MTK Co Ltd.
Mapper Lithography
Materion
Mattson Technology
Mechatronic Systemtechnik
Metryx
MicroChem
MicroFab Technologies Inc
Micronic Laser Systems AB
Micronics Japan Co.
Mitshubishi Gas Chemical
Mitsubishi Chemical Corporation
Mitsubishi Electric
Mitsubishi Heavy Industry (MHI)
Mitsubishi Materials
Mitsubishi Materials Corporation
Mitsui Chemicals
Momentive Performance Material Inc.
Mühlbauer
NANOPLAS
NEC / SCHOTT
NEXX Systems
NOVELLUS
Nagase & Co. Ltd.
Namics
Nanda Tech GmbH
Nanovea
Newport
Nikko Metal
Nikon Corporation
Nippon Electric Glass Co. Ltd. NEG
Nippon Kayaku Co. Ltd.
Nippon Sheet Glass Co. Ltd. NSG
Nissan Chemical Industries
Nitta Haas Inc.
Nitto Denko Corporation
Norcom Systems Inc
Nordson ASYMTEK Inc.
Nordson March
Nordson dage
OM Group Ultra Pure Chemicals Pte. Ltd.
OPµS
Oerlikon
Okmetic
Orbotech Ltd.
Oxford Instrument
PANASONIC Factory Solutions
PVA TePla AG
Palomar Technologies Inc.
Panasonic Denko
Philips Applied Technologies
Plan Optik AG GmbH
Polymatech
Praxair.com
Promerus LLC
Protavic America Inc.
REC Silicon
RENA GmbH
Ramgraber GmbH
Replisaurus Technologies
Ricmar Technology GmbH
Rorze
Rudolph Technologies
SAMCO Inc.
SCS Speciality Coating Systems
SET Smart Equipment Technology
SHINKAWA LTD.
SOITEC
SONOSCAN
SPP (Sumitomo Precision Products Co. Ltd.)
SPTS
SSEC Solid State Equipment Corporation
STIL SA
SUSS Microtec
Saint-Gobain
Schmoll Machinen
Schott AG
Sekisui Chemical Co. Ltd.
Semiconductor Technologies & Instruments (ASTI)
Semprius
Senju Metal Industry Co. Ltd.
Shibaura Mechatronics Corporation
Shin-Etsu MicroSi Inc
Siconnex
Silecs
Singulus
Sokudo Co. Ltd.
SolMateS
Solvay
Starfire Systems Inc.
Strasbaugh
Sumco Corporation
Sumitomo Bakelite
Sumitomo Chemicals
Surface Science Integartion
TEGAL
TEL (Tokyo Electron LTD.)
TOK (Tokyo Ohka Kogyo Co. Ltd.)
TOWA Corporation
TRESKY
TRIOPTICS
Takatori Ltd.
Tamar Technology
Tamarack Scientific
Tango Systems
Tecnisco
Teradyne
Thin materials AG
Timbre Technologies
Toray Engineering Co. Ltd.
Toray Industries
ULVAC Inc.
Ultraspray
Ultratech
Umicore
Uyemura Co. Ltd.
Uyemura International Corporation
Veeco
Zeon Chemicals L.P.
Zygo Corporation Inc
hin-Etsu Chemical Co. Ltd.
nScrypt Inc.
picoDRILL
rasco
For more information visit http://www.researchandmarkets.com/research/t4dphj/equipment_and
Media Contact: Laura Wood , +353-1-481-1716, press@researchandmarkets.net
SOURCE Research and Markets
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