2014-05-28

The Electronics Distribution Show (EDS) held earlier this month not only highlights the tight partnerships between electronic component manufacturers and distributors, it also gives component suppliers the chance to showcase some of their newest product introductions. This year many of the new products fell into the category of interconnect, passive and electromechanical (IP&E) components from AVX, ERNI, HARTING, Hirose, Laird, Orion Fans, Stackpole Electronics and VCC. Here’s a sampling of IP&E components highlighted at the show.

One of the most interesting products came from Laird, which introduced a new series of miniature thermoelectric modules (TEMs) built using the company’s Tlam thermally conductive circuit boards instead of traditional ceramic-based circuit boards. The company said the use of the Tlam circuit board improves the heat pumping capabilities of the device while providing excellent heat spreading, improved reliability and lower cost in high volume when compared to traditional heat removal systems. Tlam is used in applications where the components in the circuit produce a lot of heat, such as high powered LEDs, power supplies or motor drives.

Another new cooling device is Orion Fans’ airflow monitoring system that provides a simple alternative for indicating airflow in AC or DC fan/blower applications. The AFM Series module operates an optical LED or audible alarm when airflow falls below 8.2 ft/s due to fan filter clogs or foreign materials coming in contact with the fan blade. The AFM airflow sensor protects components like power supplies, PoE midspans, and displays in sensitive equipment including servers, telecom switches, medical equipment and kiosks. It is also well suited to MRO applications since it is field retrofittable for AC or DC fan blower applications.

In the passives arena, Stackpole Electronics introduced several new resistors including the HCS series, CSRF series and RPC series. The HCS Series of shunt resistors offers high current handling and lower self-heating. It uses a solid metal element that is elevated off the mounting plane, which increases the ability of the part to dissipate the heat into the ambient air and not into the printed circuit board (PCB). The HCS2512, for example, will run typically 15 to 20 degrees C cooler than an equivalent flat chip, said the company.

The Stackpole CSRF series of surface-mount current sense resistors provides very low resistance values in small case sizes while maintaining good temperature coefficient of resistance (TCR). The 0402 size is available in the popular 10 milliohm value, while the 0603 size is available in values down to 5 milliohms. The combination of low resistance values and good TCR make the devices well suited for portable consumer electronics, including laptops, netbooks, tablets, e-readers, and portable media players. This translates into more efficient battery and power management and longer battery life.

Stackpole also expanded the RPC series of pulse withstanding chip resistors with parts available with tolerance as tight as 0.5%. The tighter tolerances make the series a good choice for a variety of general purpose and precision applications, including electronic scales and measurement systems, data acquisition, precision LED lighting controls, vehicle lighting systems, medical systems, and low power converters.

Interconnects showcased at EDS include ERNI’s high-current PowerElement series, which is part of the company’s BLUEcontact Solutions portfolio. Targeting industrial and heavy-equipment providers, ERNI expanded the line to include combined flexible/massive press-fit and purely massive press-fit technologies. The high power wire-to-board connectors with press-fit terminations provide a gas-tight interface to the PCB via, eliminating the need for high temperature soldering and its negative effects on the PCB substrate, said ERNI. Applications include vehicle electrical systems, power distribution assemblies, buss-bars, and hybrid applications that require high power solutions and reliability requirements.

ERNI also expanded its PCI Express (PCIe) connector offering with an 85-Ohm right-angle connector series that provides design flexibility and space savings where low clearance above the PCB prohibits the use of vertical configurations. The card-edge connector series meets all PCIe Local Bus Standards Rev. 3.0. Applications include consumer, server, and industrial markets. The right angle PCIe connector’s footprint is identical to the standard vertical mount configuration. These connectors enable the add-on card to be mounted parallel to the motherboard, saving space in the overall height allowed within the chassis.

Another space-saving interconnect is Hirose’s DF62 wire-to-wire connectors. The company expanded the DF62 Series of slim in-line connectors with the introduction of two new versions with unique plug/socket shapes. The enhanced DF62 connectors feature a pin layout arranged in a 2.2- x 2-mm grid pattern reducing the diagonal diameter by 50 percent, which makes it well suited for space-constrained applications. Using a highly reliable two-point contact design, the DF62 Series delivers ruggedized connectivity that is resistant to shock and vibration. It also offers an advanced lock protection system.

Also aimed at saving space is HARTING’s Han Yellock line of modular industrial connectors, which now includes a smaller size. The Han-Yellock 10 can fit both rectangular and circular panel cut outs, allowing direct replacement of circular connectors with a panel cut out diameter between 28 – 30 mm. It joins the Han-Yellock sizes 30 and 60 and comes with either cable glands M20 or M25, top or angled entry. The Han-Yellock line features a unique, internal latched locking/unlocking mechanism for extremely fast field connections. It can be used for power only, or for combinations of power, signal and/or data. Any Han 3A insert – over 25 in all – will fit in this modular connector.

For greater design flexibility, HARTING introduces the har-flexicon series of discrete wire-to-board connectors and terminal blocks that are said to deliver greater printed-circuit-board (PCB) performance and density with robust connectivity. These miniature har-flexicon SMT (surface-mount termination) components for pluggable single conductor wiring of I/O signals are available in two main pitch categories ‒ traditional 3.5- to 5.08-mm sizes and 1.27- and 2.54-mm sizes.

Another connector line that features greater flexibility is Hirose’s customizable series of board-to-board power connectors that feature a 3-piece structure consisting of the mating receptacle, the interposer, and the mounting receptacle. The IT-P Series provides a wide range of variable height interposers to achieve board-to-board stack heights ranging from 13.5 mm to 44 mm. These connectors are designed for assembly with the stackable IT3 and IT5 Series high-speed mezzanine connectors.

A unique interconnect from AVX is a series of single pogo pin board-to-board (BTB) contacts designed for use in high lifecycle commercial, industrial, medical, and military applications. These interconnects are available in five standard compressed stacking heights from 2.0 mm to 5.0 mm, which is the maximum working range and compressed height tolerance possible in a miniature 1.5-mm diameter plunger. The 70-9150 Series contacts provide low-cost, off-the-shelf connector solutions for an extensive range of applications, said the company. This enables design flexibility in terms of pin count and placement location. The single pogo pin contacts feature gold plating for high reliability and signal integrity.

AVX also introduced several new capacitor products. The capacitor manufacturer expanded the capacitor/voltage (C/V) ratings for its X7R MLCCs, as well as extended the dielectric range of its COTS MLCC series. Available in sizes from 01005 to 2225, the AVX X7R MLCCs exhibit high K and low equivalent series resistance (ESR) and are now available with capacitance values from 100 pF to 47 µF and standard voltage ratings spanning 4V-500V. High-voltage X7R MLCCs with ratings up to 5000V are also available, as are automotive and alternate termination options. Applications include decoupling and filtering in mobile, medical, and digital applications, such as cell phones, tablets, high speed processors/FPGAs, and implantable medical devices. The series is also well suited for use as snubbers, resonators, filters, or DC blocking caps in automotive, medical, industrial, and commercial electronics, including displays, high voltage multipliers, high frequency power converters, and SMPS.

AVX also added high temperature X8R and X8L dielectric components to its high-reliability APS Series of multilayer ceramic capacitors (MLCCs) for commercial off-the-shelf (COTS) applications. Extensively tested using many of the MIL-STD test methods as used in MIL-PRF-55681, the APS Series MLCCs exhibit an ultra-low field failure rate of <1ppb. Now available in NP0, X7R, X8R, and X8L dielectrics, in addition to a wider capacitance range than MIL spec parts, and a variety of case sizes, voltages, and termination finishes, the surface-mount MLCCs satisfy COTS requirements for higher capacitance/voltage (CV) and PCB space-saving requirements. These capacitors can be used in military, aviation, and telecommunications applications.

If you’re looking for a neon indicator that operates in rugged conditions, VCC has developed a relampable neon front-panel indicator light for harsh environments. The 513x-038 Series meets MIL-L-3661 specifications and is available rated to NEMA 4 protection. These indicators can be used in safety, outdoor, aircraft and military, industrial machinery and instrumentation applications.

In most cases, these products are available through the component manufacturer’s distribution partners.

The post EDS Showcases IP&E Components appeared first on ELECTRONICS PURCHASING STRATEGIES.

Show more